PolyMide™ CoPA is based on a copolymer of
Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and
heat resistance of up to 180˚C.
RECOMMENDED PRINTING CONDITIONS
* Based on 0.4 mm nozzle and Simplify 3D v.4.0. Printing conditions may vary with different
nozzle diameters
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|
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|
Nozzle temperature |
250 – 270 (℃) |
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Build surface material |
PA film, PI film |
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Build surface treatment |
Glue |
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Build plate temperature |
25 - 50 (˚C) |
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Cooling fan |
OFF |
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Printing speed |
30-60 (mm/s) |
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Raft separation distance |
0.2 (mm) |
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Retraction distance |
3 (mm) |
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Retraction speed |
40 (mm/s) |
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Environmental temperature |
40 - 60 (˚C) |
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Threshold overhang angle |
55 (˚) |
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Recommended support material |
PolyDissolve™ S1 |
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PROPERTY |
TESTING MODELS |
TYPICAL VALUE |
|
Density |
ISO1183,
GB/T1033 |
1.12
g/cm3 at 23°C |
|
Melt index |
260°C,
1.2 kg |
12
g/10min |
MECHANICAL PROPERTIES (DRY STATUS)
|
PROPERTY |
TESTING METHOD |
TYPICAL VALUE |
|
Young’s modulus (X-Y) |
ISO 527, GB/T 1040 |
2223
± 199 MPa |
|
Young’s modulus (Z) |
2564
± 97 MPa |
|
|
Tensile strength (X-Y) |
ISO 527, GB/T 1040 |
66.2
± 0.9 MPa |
|
Tensile strength (Z) |
43.3
± 9.1 MPa |
|
|
Elongation at break (X-Y) |
ISO 527, GB/T 1040 |
9.9
± 1.5 % |
|
Elongation at break (Z) |
1.8
± 0.4 % |
|
|
Bending modulus (X-Y) |
ISO 178, GB/T 9341 |
1667
± 118 MPa |
|
Bending modulus (Z) |
N/A
|
|
|
Bending strength (X-Y) |
₹4,700
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